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Lecturer(s)
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Michal Ondřej, Ing. Ph.D.
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Hornak Jaroslav, Ing. Ph.D.
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Trnka Pavel, Prof. Ing. Ph.D., MBA
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Pretl Silvan, Ing. Ph.D.
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Course content
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1. Introduction - summary of the subject's content, hierarchy of advanced technologies for assembly of electronic units and electric machines, definitions of terms 2. Advanced PCB technology (HDI, rigid-flex) 3. Flexible PCB (FPC, stretchable, freeform PCB) 4. Technology of thin and thick layers (vacuum deposition, printing processes) 5. Hybrid assembly in electronics (HIO, FHE, embedding) 6. Advanced methods of encapsulation of modern semiconductor devices (MCM, 3D packaging) 7. The technology of electrical isolation systems in transformers from the beginning to the present 8. Magnetic circuits of large machines 9. The technology of electrical insulating systems of rotating machines from the beginning to the present 10. Composite materials in high-voltage machines, VPI technology and Resin Rich 11. Bushings, insulators, skeletons, vessels, branch switches, engineering technologies 12. Methods of cooling large machines 13: Production and operating environment, purity, quality, testing, reliability, service life of electronic assemblies and electrical machines.
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Learning activities and teaching methods
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- Preparation for formative assessments (2-20)
- 4 hours per semester
- Preparation for laboratory testing; outcome analysis (1-8)
- 8 hours per semester
- Preparation for an examination (30-60)
- 45 hours per semester
- Preparation for comprehensive test (10-40)
- 15 hours per semester
- Contact hours
- 65 hours per semester
- unspecified
- 45 hours per semester
- Contact hours
- 20 hours per semester
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| prerequisite |
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| Knowledge |
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| apply basic knowledge from the field of materials in electrical engineering |
| Skills |
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| recognize differences in design and materials used in electronic assemblies and electrical machines |
| assess the technological and material properties |
| apply skills in the field of electrical measurements |
| use basic mathematical and statistical procedures |
| to apply knowledge about materials and basic technological processes in electronics and high voltage engineering |
| apply the knowledge of the basics of electrical engineering |
| Competences |
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| N/A |
| N/A |
| N/A |
| learning outcomes |
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| Knowledge |
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| explain the technological processes in the production of advanced printed circuit boards and electronic components |
| discuss the specific aspects, advantages and disadvantages of hybrid assembly in electronics |
| describe the specifics of using flexible printed circuit boards |
| explain the suitability of thin film and thick-film technology |
| elucidate the concepts and technological procedures of advanced encapsulation of modern semiconductor devices |
| describe the production technologies of transformers windings, rotating machines |
| justify the use of specific composite material in the construction of electronic devices and el. machines |
| Skills |
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| recognize the design and materials used in the advanced PCB |
| identify the assembly errors on the printed circuit board |
| describe the internal structure of an advanced semiconductor electronic system package |
| underpin the analysis of the technological process by literature review |
| use basic mathematical and statistical procedures |
| Competences |
|---|
| N/A |
| N/A |
| teaching methods |
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| Knowledge |
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| Lecture with visual aids |
| Multimedia supported teaching |
| Skills |
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| Practicum |
| Competences |
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| Project-based instruction |
| assessment methods |
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| Knowledge |
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| Combined exam |
| Seminar work |
| Skills demonstration during practicum |
| Skills |
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| Skills demonstration during practicum |
| Seminar work |
| Competences |
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| Individual presentation at a seminar |
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Recommended literature
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Gupta, Tapan. Handbook of thick- and thin-film hybrid microelectronics. Hoboken : Wiley-Interscience, 2003. ISBN 0-471-27229-9.
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Happy Holden. The HDI Handbook. BR Publishing, Inc., 2009. ISBN 978-0-9796189-1-8.
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