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Fremr David, Ing.
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Štáhl Pavel, Ing.
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Hirman Martin, Ing. Ph.D.
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Skočil Vlastimil, Doc. Ing. CSc.
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Šimota Jan, Ing.
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Pretl Silvan, Ing. Ph.D.
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Wirth Václav, Ing.
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Kapounová Veronika, Ing.
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Rendl Karel, Ing. Ph.D.
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Flekalová Martina, Ing.
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Machač Jan, Ing.
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Vik Robert, Ing. Ph.D.
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Řeřicha Tomáš, Ing. Ph.D.
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Winkelhölferová Martina, Ing.
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Navrátil Jiří, Ing. Ph.D.
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Záruba Jan, Ing.
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Soukup Radek, Doc. Ing. Ph.D.
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Bystřický Tomáš, Ing.
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Hlína Jiří, Ing. Ph.D.
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Pavec Martin, Ing.
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Kalaš David, Ing. Ph.D.
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Švehla Michal, Ing.
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Suchý Stanislav, Ing.
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Šlauf Josef, Ing.
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Janda Martin, Ing.
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1. Intruction - determination of conceptions, case - history, segmentation, sequence, position and perspective in CR and in world, capacities, economy, environmental science 2. Materials and technology - principles of selection, perspective, properties 3. Substrates - materials, technology, properties 4. Differentiation of surfaces - materials, technology, arrangement 5. Printed circuits - types, technology, perspective, arrangement 6. Surface mounting - technology, benefits 7. Electronic components - partition, types, ranks, terminals, marking, technical and service conditions 8. Components placement - types, technology, arrangement 9. Soldering and adhesive bonding - principles, types, usage, solder, soldering flux, glue, arrangement 10. Hybrid integrated circuits - types, properties, technology 11. Cleaning - types of impurities, characteristics of cleanness, arrangement 12. Checking, testing, inspection, reliability 13. Production and operational environment - influences, their compression, clean environment, ESD Exercising: 1. Introductory information, laboratory order, safeness, progress chart of exercising, technological processing of DPS, substrates for DPS (audiovisual presentation). 2. Running test, work on semestral project (milling, photolithography). 3. Differentiation of surfaces and volume, insertion of components, technology of soldering (audiovisual presentation). 4. Running test, work on semestral project (boring, insertion of components, soldering). 5. Optical and functional verification, encapsulation of components, ESD (audiovisual presentation). 6. Work on semestral project (optical and functional verification), credit test. 7. Verification of semestral works, conferment of credits
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Mach, Pavel; Skočil, Vlastimil; Urbánek, Jan. Montáž v elektronice : pouzdření aktivních součástek, plošné spoje. Vyd. 1. Praha : Vydavatelství ČVUT, 2001. ISBN 80-01-02392-3.
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Urbánek, Jan; Klabačka, Edvard. Technologie elektronických zařízení. 1. vyd. Praha : ČVUT, 1997. ISBN 80-01-01551-3.
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